 |
Crystal
structure: hexagonal (amorphous for most VLSI applications) |
 |
Atomic
Weight 140.28 |
 |
Thermal
Conductivity 16-33 W/m-K |
 |
Thermal
diffusivity .32 cm**2/s |
 |
Relative
Dielectric Constant 7.5 |
 |
Index
of Refraction 2.0 |
 |
Dielectric
Constant F/m |
 |
Electrical
Resistivity > 10e12 ohm-meter |
 |
Breakdown
field V/m |
 |
Atomic
Density 1.48e22 molecules/cm**3 |
 |
Density
3.44 g/cm**3 |
 |
Coefficient
of Thermal Linear Expansion 2.8e- 6 to 3.6e-6 /K |
 |
Energy
Gap 4.7 eV |
 |
Specific
Heat .17 J/g-K |
 |
Melting
point ~1900 C |
 |
Young's
Modulus 304 GPa |
 |
Poisson's
Ratio .24 |
 |
Koop
Hardness 2200 |
 |
Modulus
of Rupture 414-580 MPa |